Malaysia is aggressively targeting $107 billion in investments to bolster its semiconductor industry, according to Prime Minister Anwar Ibrahim. The country, already a significant player in semiconductor testing and packaging, aims to strengthen its position as a global manufacturing hub. Anwar outlined plans to attract investments for integrated circuit design, advanced packaging, and manufacturing equipment, alongside the establishment of local companies in these sectors.
To support these ambitious goals, Malaysia plans to allocate $5.3 billion in fiscal support. Anwar emphasizes the country’s capability to diversify and ascend the value chain, focusing on high-end manufacturing, semiconductor design, and advanced packaging. Despite lacking a specific timeline, Malaysia’s strategy includes incentives like tax breaks and subsidies to entice global tech companies and investors, showcasing its commitment to advancing the semiconductor sector.
Malaysia’s strategic positioning is evident as it attracts major investments from leading semiconductor firms like Intel and Infineon. With plans for an integrated circuit design park and partnerships with global players, Malaysia aims to capture further business in the semiconductor industry, especially as Chinese chip firms seek assembly solutions outside China. Through such initiatives, Malaysia is poised to solidify its status as a key player in the global semiconductor market and propel its economy forward.
